RESEARCH PAPER

Our latest research delves into the future of electronic devices' protection against electromagnetic emissions.
Electronics are the backbone of our modern world, but their sensitivity to electromagnetic emissions poses challenges. DONE Lab team has explored cutting-edge solutions using additive manufacturing technologies and thermoplastic composites to revolutionize electronic enclosures.
Read the full article here:
https://www.mdpi.com/2073-4360/15/24/4649